Equipment

• Scanning Electron Microscope (SEM): Zeiss SUPRA55-VP.

Electron Beam Lithography NPGS with resolutions down to 10s of nanometers.

• Atomic Layer Deposition (ALD): Beneq TFS200.

Deposition of single-layers of dielectric metal oxides.

• High vacuum magnetron sputtering: CVC & Orion-8-UHV.

Sputter deposition of thin layers of Ag, Al, Au, C, Cr,  Cu, Fe, ITO, NiCr 80/20, Pt, Ti, TiW; Al, Al2O3, Nb, Pd

• Thermal deposition: Denton DV-502A.

Thermal deposition of thin layers of Au, Al etc.

• Reactive Ion Etching (RIE): Plasmalab 80

Allows substrates to be etched in plasma.

• Photo mask aligning & exposure: Karl Suss MJB-3.

Optical lithography with a resolution down to 2μm.

• Energy Dispersive Microanalysis: Oxford Instruments INCA Energy.

Allows for the analysis of atomic composition of samples.

• K&S wirebonder: Makes electrical connections.

• Stylus Film Thickness Profilometer: DektakXT.

Gives a 2D profile of the substrate via a metallic stylus.

• Thin Film Measurement/ Optical microscope: Leitz Ergolux/Filmetrics F40

• Controlled gas ambient quartz tube furnaces: Lindberg, Thermtek.

Chemical Vapor Deposition of carbon nanotubes and various 2D materials.

• Leak Detector, Three-mass: Pfeiffer QualyTest

• Wet benches with fume extraction